{"id":2727,"date":"2014-06-23T10:39:09","date_gmt":"2014-06-23T09:39:09","guid":{"rendered":"https:\/\/www.ultraflux.net\/controle-debit-dazote-gazeux-process-fabrication-semi-conducteurs-2\/"},"modified":"2023-03-23T09:32:33","modified_gmt":"2023-03-23T08:32:33","slug":"flow-rate-measurement-of-gaseous-nitrogen","status":"publish","type":"page","link":"https:\/\/www.ultraflux.net\/en\/applications\/industry\/flow-rate-measurement-of-gaseous-nitrogen\/","title":{"rendered":"Flow rate measurement of gaseous nitrogen *"},"content":{"rendered":"
\n*\u00a0in the manufacturing process\u00a0for semi-conductors<\/p>\n<\/div>\n
\nFlow rate measurement of ultra pure nitrogen on the production line for semi-conductors. Ultra pure nitrogen is used to remove impurities following the silicon etching process performed on high frequency integrated circuits intended for telephone applications.<\/p>\n<\/div><\/div><\/div>\n
\nThe measurements must be performed with a maximum pressure of 7 bars, at a maximum gross flow rate of 5m3<\/sup>\/hr. To adapt quickly to the gas network to be measured, “Swagelock” quick-fit connections are used. This measurement must have a minimum loss of pressure and present no risk whatsoever in terms of contamination of the gas.<\/p>\n<\/div><\/div><\/div>\n